
Building a silicon skyscraper with chips and goo

3D chip goo needs to hold tight and move heat
与内存和网络元件紧密封装在一起的处理器能够制造出比目前最快的微处理器快1000倍的计算机芯片。
根据合作协议,IBM将帮助封装半导体。3M将开发和生产粘合剂材料。
Building a silicon skyscraper with chips and goo
3D chip goo needs to hold tight and move heat